Expected to generate over 20,000 direct and indirect skilled jobs, the fab will possess a manufacturing capacity of up to 50,000 wafers per month. (Representational File Photo: PTI)
The semiconductor fabrication facility, located over two hours away from Ahmedabad, will be established by Tata Electronics Private Limited (TEPL), a wholly-owned subsidiary of Tata Sons Pvt Ltd, with an investment of over Rs 91,000 crore
In a significant stride towards bolstering India’s semiconductor manufacturing capabilities, Prime Minister Narendra Modi is set to lay the foundation stone for a semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) in Gujarat today. Gujarat Chief Minister Bhupendrabhai Patel, Union IT Minister Ashwini Vaishnaw, and other dignitaries will also attend the event. Tata Sons chairman N Chandrasekaran will also be there.
The semiconductor fabrication facility, located over two hours away from Ahmedabad, will be established by Tata Electronics Private Limited (TEPL), a wholly-owned subsidiary of Tata Sons Pvt Ltd. With an investment of over Rs 91,000 crore, the facility marks a significant milestone as the country’s first commercial semiconductor fab. The project is a joint venture between TEPL and Taiwan’s Powerchip Semiconductor Manufacturing Corp (PSMC).
Expected to generate over 20,000 direct and indirect skilled jobs, the fab will possess a manufacturing capacity of up to 50,000 wafers per month. Incorporating next-generation factory automation capabilities, including data analytics and machine learning, it aims to achieve industry-best factory efficiency.
The semiconductor fab will produce chips catering to various applications such as power management IC, display drivers, microcontrollers, and high-performance computing logic, meeting the escalating demands in sectors like automotive, computing, data storage, wireless communication, and artificial intelligence.
In addition to the Dholera project, PM Modi, under the ‘India’s Techade: Chips for Viksit Bharat’ initiative, will virtually lay the foundation stones for two other facilities approved by the Cabinet recently. One such facility will be established in Sanand, Gujarat, in collaboration with CG Power and Renesas, a leading Japanese semiconductor manufacturer. The investment for this project is estimated to be around Rs 7,500 crore.
PM Modi will also lay foundation stone for another such facility in Assam, facilitated by Tata, with a substantial investment of Rs 27,000 crore. This strategic move aims to fortify semiconductor infrastructure in the north-eastern region, fostering regional economic development and technological advancement.
India’s prowess in chip design is already well-established, and with the establishment of these units, experts believe that the nation is poised to further enhance its capabilities in chip fabrication, marking a significant leap towards self-reliance in the semiconductor industry.
